Atotech an MKS Brand
On-demand
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On-demandDriven by an increase in design complexity and growing demand for high input and output in package substrates, the dimension of conductor tracks line and spaces is predicted to be reduced gradually to 5/5 µm and lower. The conventional approach to...
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On-demandIs it possible to operate an electroless nickel process at 75 °C and still achieve the required plating speed? Yes, it is – with our revolutionary low-temperature mid-P EN process Nichem® MP 75.
Compared to conventional electroless nickel system... -
On-demandThe Semi Additive Process (SAP) enables very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and spaces (L/S) of 10/10 µm and less the copper thickness variation is one of the cr...
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On-demandMixed reaction gold electrolytes with high autocatalytic portions are gaining more and more market acceptance. Already in 2010, Atotech introduced the first gold electrolyte with autocatalytic properties Aurotech® G-Bond for ENEPIG applications. W...
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On-demandElectroless deposition of nickel phosphorus alloy coatings (Ni-P) has been widely used in many industrial applications because of the unique properties they impart such as wear resistance, non-magnetism, hardness, coating thickness uniformity and ...
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On-demandPCB manufacturing of HDIs and IC substrates with fine lines and spaces requires a high focus on uniform copper deposition, thin copper thickness and minimized defects to maximize the production yield. In addition to this the consumption of resourc...
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On-demandThe weight reduction drive for using lighter metals in vehicles is increasing as the automotive industry moves towards electrification. At the same time, weight reduction is also becoming increasingly important in other areas, such as portable dev...
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On-demandNext generation packaging applications require ever smaller structures without compromising on the reliability of the devices. To achieve this, highly pure and sophisticated plating chemicals are required, which allow the deposition of fine RDL st...
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On-demandWith miniaturization in electronics comes the need for ever-shrinking line and space requirements. Existing differential etching methods are reaching their limits as mouse bites and shape changes have an increasingly negative impact on performance...
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On-demandGrowing e-vehicle market requires a highly conductive material for connectors and busbars. Deposit hardness has become a prerequisite for busbars and most connectors. Contact resistance is the other important parameter being paid attention in this...
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On-demandZinc and zinc alloy plating is a very energy-intensive production process. Rectifiers as well as heating and cooling of the various baths from cleaning to plating and post-treatment contribute to significant power consumption throughout the platin...
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On-demandOrganic surface finishes provide a solderable environmentally friendly finish for fabricators in the electronics industry. The key to the potency of the process is the number of reflow cycles the finish can endure. Additionally, the thickness of t...
