Atotech Group
On-demand
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On-DemandThe electroless nickel process, since its invention in 1946 by Brenner & Riddell, has undergone many changes to improve the operating performance, deposit properties and adaptation to new environmental legislation. However, the basic principle of ...
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On-DemandNext-generation advanced packaging applications require ever smaller structures without compromising on reliability. To achieve this, it demands highly sophisticated plating chemicals, which allow fast plating, highest purities, and complete shape...
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On-DemandWith our endless devotion to developing innovative universal and economic PCB final finishes, we are pleased to introduce the new industry benchmark – PD-Core® and Aurotech® G-Bond 2.
Ni/Pd and Ni/Pd/Au finishes are covering multiple possible app... -
On-DemandPalladium-Nickel (Pd/Ni) layers have been a valid alternative to Gold layers for almost 40 years. In the world of connectors, Pd/Ni has been known as a highly reliable and economical solution. However, in recent years the precious metal market has...
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On-DemandAtotech provides the technology that enables manufacturers of advanced PCBs and IC packages to manage and control the critical factors during production, such as minimal to non generation of sludge when etching during the oxide replacement process...
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On-DemandIn recent years new energy vehicles (NEVs), with their promise of reducing pollution and conserving our energy reserves, have raced into the mainstream.
Not only has E-mobility changed the source of energy for propulsion but it has also stimulate... -
On-DemandIts high corrosion resistance and hardness, combined with the uniform thickness distribution of the deposit, make electroless nickel plating an ideal coating for extending the life of high-value components used in various industries such as automo...
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Tuesday, February 9, 2021 · 8:00 PM CETIn one of our recent research work, we looked at the current and next generation advanced packaging technologies with regards to reliability and made some very interesting observations. Based on these results we developed a new ultra-pure Copper d...
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Tuesday, February 9, 2021 · 9:00 AM CETIn one of our recent research work, we looked at the current and next generation advanced packaging technologies with regards to reliability and made some very interesting observations. Based on these results we developed a new ultra-pure Copper d...
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On-DemandFully automated assembly lines used for automotive manufacturing continue to pose new challenges for fastener suppliers. The fact that automotive manufacturers pursue different assembly strategies means that well-known friction standards such as I...
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Wednesday, January 27, 2021 · 8:00 PM CETElectroless nickel/electroless palladium/immersion gold ENEPIG is a highly reliable finish with a broad application field due to its multiple soldering and bonding capabilities. In this webinar, we will introduce PD-Core® as a new electroless plat...
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Wednesday, January 27, 2021 · 9:00 AM CETElectroless nickel/electroless palladium/immersion gold ENEPIG is a highly reliable finish with a broad application field due to its multiple soldering and bonding capabilities. In this webinar, we will introduce PD-Core® as a new electroless plat...
