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Atotech Group
Atotech Group
Upcoming
On-demand
  • Through hole filling for improved heat dissipation on dense circuits
    Tuesday, July 28, 2020 · 8:00 PM CEST
    Thermal management on a substrate is one of the hot topics with regards to reliability of electronic devices. With increased power and packing density of electronic components more and more heat is generated. This will lead to failures of electron...
  • Through hole filling for improved heat dissipation on dense circuits
    Tuesday, July 28, 2020 · 9:30 AM CEST
    Thermal management on a substrate is one of the hot topics with regards to reliability of electronic devices. With increased power and packing density of electronic components more and more heat is generated. This will lead to failures of electron...
  • The importance of reliability when plating electrolytic stacked BMVs
    Tuesday, June 30, 2020 · 9:30 AM CEST
    The continuously increasing thermo-mechanic reliability requirements for e.g. automotive electronics and 5G hand-held PCBs need a better understanding of all production processes. Apart from the contribution of the well-known factors like base ma...
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