Webinar: 3D Heterogeneous Integration (3DHI) RF/Microwave/mmWave Solutions for Design of Phased Array Systems by Horizon House Publications

3D Heterogeneous Integration (3DHI) RF/Microwave/mmWave Solutions for Design of Phased Array Systems

About

3D Heterogeneous Integration (3DHI) rapidly emerges as the ideal integration solution for constructing high performance RF/MW/mmW hardware modules that comprise RFICs, MMICs, IC packaging, integrated passives, SMDs, interposers and phased array antenna elements. You will learn how 3DHI modules can be flexibly fabricated to accommodate these multi-technology components. The EDA tools needed to correctly assemble and interconnect these mixed technology components into a 3DHI structure will be demonstrated. Then learn how accurate circuit-EM cosimulation can be interactively performed on any selected RF paths through the 3DHI structure without disturbing the 3D layout. Finally, we appreciate how a 3DHI phased-array module can be accurately simulated for beam forming characteristics before HW fabrication.

Presenters

Dr. Ian Rippke

Director of Software Solutions Engineering, Keysight Technologies

Dr. Rippke has 20 years of experience working in the simulation and design of high-frequency integrated circuits, including several technical publications and patents. In his current role, he is the Director of Keysight’s EDA Solutions Engineering and Services team in the Americas.

Previously, he served as the product manager of the System Simulation segment, which included Keysight’s SystemVue RF system design platform, where he oversaw the launch of Keysight’s RF digital twin strategy and its development. Previously, he was an RFIC simulation specialist in the Keysight EDA software field sales team. He holds a BSEE from Lafayette College and a Ph.D. in Electrical Engineering from Cornell University.

Nathan Altaffer

Solutions Engineer, Keysight Technologies

Nathan works with and coordinates Applications Engineering teams to ensure customers derive maximum value from their Keysight EDA design tools (ADS, EMPro, Momentum, FEM, SystemVue, IC Cap, Genesys) and design flows. He monitors and manages all technical account activities, including training, services, support, and tool evaluations. Nathan collaborates with customers, Subject Matter Experts, and R&D to develop new design capabilities and design flows that address customers' evolving and complex design requirements.

Edward Horne

Director of Systems Engineering, 3D Glass Solutions

Edward is the Director of Systems Engineering at 3DGS and is responsible for helping customers implement their designs using 3DGS technology. He brings 20+ years of experience leading technical teams in RF design, characterization, modeling, and manufacturing. At Paratek Microwave, he designed the tunable RF chip in the first ever antenna tuner inside a cellphone, which is now an industry standard, leading to an acquisition by BlackBerry. At BlackBerry and NXP Semiconductors in systems engineering roles, he focused on developing new radio architectures and advanced RF technologies. He holds BS and MS degrees in electrical engineering from the University of Waterloo.

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