Register
Full name*
Email Address*
Job Title
Organization*
Country*
Marketing Permission
Atotech Group will use the information you provide on this form to be in touch with you and to provide updates and marketing. We will not share or sell your personal information. You can unsubscribe anytime by clicking the unsubscribe link in the footer of our emails, or by replying to our emails and asking to be unsubscribed. For more information, please read our privacy policy.
Yes, I consent to receiving emails other than the invitation*
We use BigMarker as our webinar platform. By clicking Register, you acknowledge that the information you provide will be transferred to BigMarker processing in accordance with their Terms of Service and Privacy Policy.
Mixed reaction gold electrolytes with high autocatalytic portions are gaining more and more market acceptance. Already in 2010, Atotech introduced the first gold electrolyte with autocatalytic properties Aurotech® G-Bond for ENEPIG applications. With Aurotech® G-Bond 2, the next level is reached: a versatile gold electrolyte for plating of ENIG, ENEPIG and EPAG layers fulfilling the latest demands for corrosion-free ENIG finishes, high gold thickness requirements and low thickness distribution plating.

In this webinar, the capabilities of Aurotech® G-Bond 2 will be introduced and representative performance data for different finish types will be presented. Besides that also an outlook on the latest development Aurotech® G-Bond 3 will be given.
  • Introduction
  • Our solution: Aurotech® G-Bond 2
  • Outlook: Aurotech® G-Bond 3
  • Q&A session
1678886319-cc72229c94227dfc
Global Product Manager Selective Finishing Technology

Educated in Chemistry and joined Atotech in 2004 as R&D chemist in the field of final finishing. After 11 years as R&D manager for selective finishing moved to the position of the Global Product Manager in April 2019.
Share