Higher-frequency radar can support smaller antenna elements, more compact arrays and improved angular resolution, but it also introduces greater RF, thermal, packaging and integration demands. Losses become more significant, interconnect performance becomes more critical and less space is available for power, control and thermal management.
We will discuss how semiconductor technology, advanced packaging, beamforming, front-end integration and power management must work together as radar systems move to higher frequencies. We also address thermal constraints and manufacturability.