Immersion tin in one of the most robust and mature final finish solutions, which provides reliable performance in particular to the automotive industry with its high quality standards. In this webinar we will introduce the key factors attributed to soldering immersion tin. The dominant topic will be the IMC formation in relation to reflow cycles and the associated solderability performance. Different root causes for solderability issues will be discussed and explained and guidelines will be given to ensure a defect-free assembly.
Agenda
Background
IMC formation
Solder defects and root causes
Q&A
Hubertus Mertens
Global Application Manager Surface Finishing High Volume
Joined Atotech Group in 2002 as Technical Engineer Material Science. Since 2007 works in the field of final finishing. Acquired his current position in 2018 with the focus on product support for our Immersion Tin and OSP products.