The promise of gigabit speeds, far exceeding that of 4G LTE, 5G offers the possibility for home broadband services to be provided over cellular networks, bringing the higher-speed services to areas that are too cost prohibitive for laying cable. The fundamental technologies that enable 5G include mmWave, massive MIMO, beam forming and small cells.
For circuit designers for millimeter-wave frequencies the critical factors can be summarized from a printed circuit board (PCB) / IC substrate prospective as Impedance Control, Signal Integrity loss, Thermal Management and EMI Shielding. These critical factors are magnified due to the increased operating frequency for the device. High-frequency signal integrity depends on strict impedance control within the narrow geometries of the PCB/IC substrate trace and impedance are affected by the line’s cross-section dimension, shape, line/space width, and dielectric materials.
During this webinar you will be provided with a general introduction of 5G and the benefits this technology, then there will be a deep dive into the critical factors impedance control, signal integrity loss, thermal management and EMI shielding and how these can be addressed by adjusting manufacturing processes used in the fabrication of the PCB/ IC substrate.
Agenda
5G introduction
mmWave spectrum
mmWave products and challenges
Key technologies and solutions
Summary / Q&A
Kuldip Johal
Global OEM Director New Technology Pathfinding
Having more than 31 years of experience, PCB/IC substrate technology. Holding several patents, in wet chemical process enhancements and author and co-author of several technical publications for IPC, TPCA, JPCA, KPCA, IMPACT and SMTA conferences and a member of several technical committees.
Leading a team of global experts focused on advanced technology, for next generation products in the various electronics markets. Working closely with leading industry experts and academia on joint collaboration projects on solving technology challenges.