Whether the application is a military and commercial radar, commercial wireless/cellular system, complex IoT network, or a sensor solution deployed in a remote or mobile context -- modern RF systems present significant performance, power-handling, form-factor, and operating environment challenges. In many of these applications, metallized ceramics offer significant advantages. To name but three:

• Thick Film substrates/circuits are manufactured using a screen-printing process to deposit multiple layers of conductive, resistive, and dielectric materials onto an insulating substrate, typically alumina, aluminum nitride or beryllium oxide. It is cost-effective, reliable, and compatible with surface-mount technology (SMT).

• Direct Bonded Copper (DBC) consists of alumina or aluminum nitride substrate, with copper film bonded to one or both sides through a high-temperature oxidation process. They are especially well suited for power modules, where efficient heat dissipation and high current carrying capacity are needed.

• Active Metal Braze (AMB) involves brazing a copper foil, to a silicon nitride board using a high-temperature vacuum process. AMB substrates have similar electrical and thermal properties to DBC substrates but are particularly suited for applications requiring high reliability, heat dissipation and high ampacity and excellent heat spreading capabilities.

This presentation will expand on these options, with particular emphasis on thermal management, electrical properties, and mechanical considerations.