Electronic components for space cannot fail — and understanding what happens inside them starts with proper sample preparation.
In this first session of our “Inside the Component” series, we will walk through the complete methodology of cross-section sample preparation: cutting, mounting, grinding, and polishing.

You will see how each preparation step directly affects the accuracy of the analysis, and how improper techniques can mask or distort hidden defects.
We will explain why rigorous preparation is essential for failure analysis, process validation, and reliability assurance in space-grade electronics. From basic printed circuit boards (PCBs) to complex integrated circuits (ICs).

A must-attend for engineers, laboratory technicians, and manufacturers who need high-quality, reproducible microsections.