In the second session of our “Inside the Component” series, we dive into the cross-section tests required to certify electronic components for space missions.

From PCB analysis to wire-crimping and press-fit qualification, we will show how cross-sectioning delivers the physical evidence demanded by ECSS standards (ECSS-Q-ST-60, 70, 60-13).

You will learn how cross-section results support destructive physical analysis (DPA), reveal manufacturing defects, and help determine whether a device is truly “fit for purpose” in the extreme conditions of space.

Ideal for quality managers, project leaders, and anyone involved in space component qualification.

2. Cross-section analysis II. Cross-section tests: PCB/wire crimping/press-fit qualification.

Cross-section analysis is an essential and mandatory part of the qualification process for electronic components used in space applications. Space agencies such as ESA have specific standards (e.g., ESA ECSS-Q-ST-60/70/60-13 series) that require destructive physical analysis (DPA), which relies heavily on cross-sectioning, to ensure maximum reliability and dependability under extreme space conditions.

Cross-section analysis provides the critical physical evidence needed to certify that a component is “fit for purpose” and capable of surviving the harsh space.