Webinar: Online Panel: Chiplets and 3D Heterogenous Integration by Horizon House Publications

Online Panel: Chiplets and 3D Heterogenous Integration

About

This panel of experts will discuss the challenges of advanced packaging technologies such as Chiplets and 3D Heterogenous Integration including integration, stacking, signal integrity and thermal concerns. The group will discuss simulation, testing and performance advantages of these approaches.

Presenters

Eric Higham

Former Technical Editor, Microwave Journal® (Retired)

Eric previously worked as Technical Editor for Microwave Journal and is now retired. During his career, Eric also served as Director of the Advanced Semiconductor Applications and the Advanced Defense Systems Services at Strategy Analytics. He is an industry veteran with more than 40 years of semiconductor experience and has also performed a variety of engineering, business development, marketing and management functions for M/A-COM, MicroDynamics and Raytheon. Eric holds an MSEE degree from Northeastern University and a BSEE degree from Cornell University.

Chandra Gupta, PhD

Director of Business Development, Remtec

Chandra Gupta is the Business Development Manager for Remtec, Inc., where he has been contributing his extensive electronics industry expertise since 2023. With over 35 years of industry experience, Chandra has held significant roles at prominent companies such as Communications & Power Industries, Inc., Analog Devices, Inc. (formerly Hittite Microwave Corp), Aeroflex (now part of Cobham) and BAE Systems. His academic background includes a Bachelor of Science and a PhD from the University of Wales in Bangor, United Kingdom, as well as an MBA from Rutgers University. Throughout his career, Chandra has demonstrated a consistent ability to drive business growth and innovation in the technology sector.

Ken Willis

Sr. Application Engineering Group Director, Multiphysics System Analysis, Cadence

Ken Willis is a Sr. Application Engineering Group Director focusing on system-level analysis solutions at Cadence Design Systems. He has over 30 years of experience in the modeling, analysis, design, and fabrication of high-speed digital circuits. In addition to Cadence, Ken has held engineering, technical marketing, and management positions with the Tyco Printed Circuit Group, Compaq Computers, Sirocco Systems, Sycamore Networks, and Sigrity.

Florian Herrault

CEO, PseudolithIC Inc.

Florian Herrault is the Chief Executive Officer of PseudolithIC Inc., a Santa Barbara–based startup advancing next generation RFIC solutions through heterogeneous integration of compound semiconductor chiplets onto silicon CMOS platforms. He earned his PhD in electrical and electronics engineering from the University of Toulouse in 2009 before serving as a Research Engineer at Georgia Tech. From 2013 to 2022, he held roles at HRL Laboratories ranging from Senior Researcher to leading the Mm Wave Advanced Packaging Group and driving GaN transistor and MMIC technology maturation and commercialization. Florian has authored more than 50 publications and 30 patents in semiconductor integration, microsystems, and III V devices. He is a Senior IEEE member and served as the 2025 IEEE ECTC Conference General Chair.

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