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Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, Fujipoly will look at the compression characteristics of thermal gap filler pads and apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCBs.
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