Managing compression force and stress is critical in any application that incorporates gap filler pads as a thermal interface. In this webinar, Fujipoly will look at the compression characteristics of thermal gap filler pads and apply this understanding to a PCB assembly. Webinar attendees will have a better understanding of the basic analytical techniques and tests that can be performed to understand stress as well as defection in both gap filler pads and PCBs.
Christian Miraglia
Application Engineering Manager
Christian is a graduate of the New Jersey Institute of Technology and has over 15 years of experience working with Thermal interface Materials.