About
As hyperscale data centers transition to 1.6T and 3.2T optical interconnects to satisfy AI and machine learning computational workloads, co-packaged optics (CPO) and silicon photonics (PICs) have moved from laboratory demonstrations to high-volume manufacturing. Yet, optical packaging and active alignment remain among the most expensive, yield-limiting steps in the entire photonic supply chain.

Traditional alignment algorithms were engineered for single fibers or duplex channels. When applied to multichannel optical arrays, engineers are forced into an iterative compromise: optimizing outer channels sequentially while "hoping for the best" across intermediate channels. This results in slow cycle times, severe Insertion Loss (IL) penalties, and inconsistent device yields.

In this technical livestream, Justin Bressi (Aerotech) and George Ong, Ph. D. (Senko Advanced Components) detail an integrated, multi-company architecture designed to dismantle this bottleneck.

Delegates will discover:
● The Detachable Advantage: How Senko’s Metallic PIC Connector (MPC) and SEAT receptacle technology enable true modular connectivity, allowing detachable optical interfaces to be aligned and attached early in the device lifecycle (wafer and die level).
● The PICAlign Architecture: How deep hardware-level integration between Aerotech precision motion control and multichannel optical instrumentation enables simultaneous, parallel signal monitoring across all channels in real time.
● Algorithmic Innovation: How PICAlign mathematically evaluates high-dimensional search spaces simultaneously. Attendees will see how users can set minimum insertion-loss thresholds, enforce channel-to-channel power uniformity, and weight critical polarization-maintaining (PM) fibers to maximize process-specific yield.
● Empirical Validation: Case study data evaluating high-density fiber array units (FAUs) coupled to PIC grating couplers. We will present convergence curves demonstrating how the system reliably locates optical optima to within 0.05 dB–0.2 dB of empirical limits in seconds rather than minutes.
When
Wednesday, November 18, 2026 · 2:00 p.m. London (GMT +0:00)
Agenda
  • Modular, Detachable Optical Connectivity: How detachable chip-level connectors (e.g., Senko’s Metallic PIC Connector / SEAT receptacle) eliminate permanent fiber pig-tailing, unlock wafer-scale testing, and simplify high-volume co-packaged optics manufacturing.
  • The Scaling Dilemma in CPO Packaging: Why legacy active alignment algorithms are unsuitable for the throughput, cycle time, and insertion loss constraints of modern high-channel-count optical arrays.
  • Simultaneous Multichannel Alignment Architecture: The mechanics behind parallel signal monitoring and simultaneous multi-axis search that drastically reduce search-space characterization time.
  • Optimizing Process Yield via Custom Objective Functions: How mathematical weighting, channel-divergence limits, and polarization-maintaining (PM) fiber prioritization prevent edge-channel drop-off and ensure uniform coupling efficiency across all active paths.
  • Real-World Empirical Benchmarks: Lab-validated performance data showing convergence to within 0.05–0.2 dB of the theoretical global maximum in seconds, bridging the gap between sub-micron precision and commercial line throughput.
Presenters
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Justin Bressi
Business Development Manager, Aerotech Inc.
Justin Bressi is Aerotech’s Business Development Manager for the semiconductor and photonics market segments. He has 10+ years of experience in precision motion systems and robotics, holding roles in applications engineering, field sales and business development. Justin earned his bachelor's degree in mechanical engineering and his master’s degree in business administration from the University of Pittsburgh.
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George Ong, Ph. D
Associate Senior Technologist, SENKO Advanced Components
George Ong is an Associate Senior Technologist at Senko Advanced Components, specializing in next-generation optical connectivity solutions for co-packaged optics (CPO) and emerging photonic systems. His work operates at the nexus of optical design, fabrication, and system integration. Dr. Ong holds degrees from the University of Bristol and Ghent University, and completed his PhD at the University of Southampton focusing on ultrafast laser-written optical sensors.
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Paul Fanning
Editor
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