About

As the industry starts to shift from 112G to 224G PAM-4 systems, organizations like the Ethernet Alliance, SNIA, OIF, and IEEE are already looking to the next generation with 448G per lane data rates. While signal integrity issues with cabling, connectors, and modules are being addressed quickly, IC substrates and land patterns on the PCB remain a bottleneck to ensuring signal integrity at 224G and 448G.

Based on results in the literature and work done by the author, this presentation shows why UHDI design and manufacturing will be a requirement to support 224G and 448G per lane data rates. The results illustrate how materials influence signal integrity in UHDI builds, and how via/transmission line designs at UHDI feature sizes impact signal propagation in IC substrates and the PCB.

The specific bandwidth and noise margin requirements for 448G will depend on the chosen modulation format. Based on simulation results for via structures and transmission lines at UHDI feature sizes, we can compare the available channel bandwidth with the required bandwidth for PAM-6 or PAM-8 modulation. From the PCB/packaging perspectives, it appears that PAM-8 is an optimal modulation format that balances higher bandwidth against tighter noise margins in M-ary PAM signaling.

Presenter
1758217693-1e7787cb2042c1c7
Zachariah Peterson
Owner, Northwest Engineering Solutions LLC
Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2500+ technical articles on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee, and he currently serves on the IEEE P3186 Working Group.
Register To Watch Recording
First Name*
Last Name*
Email Address*
Company Name*
Job Title*
Street Address 1*
Street Address 2
State / Province*
Zip/Postal Code*
City*
Country*
What is your company's primary end product or service?*
If you selected OTHER on the End Product question, please specify.
✓
We use BigMarker as our webinar platform. By clicking Register, you acknowledge that the information you provide will be transferred to BigMarker processing in accordance with their Terms of Service and Privacy Policy.
Powered by BigMarker