About
The continued evolution of airborne electronic warfare (EW) systems is placing unprecedented pressure on radio designers to reduce size, weight, and power (SWaP) while simultaneously expanding operational bandwidth. Modern platforms are increasingly required to support legacy coverage from 2 to 18 GHz while extending into millimeter-wave frequencies beyond 40 GHz, often within the same constrained payload envelope. These competing requirements introduce significant challenges in front-end architecture, including antenna integration, filtering, channel density, and overall system efficiency.

This webinar will define the SWaP challenge in practical design terms, exploring how wideband coverage, multifunction capability, and platform constraints impact component selection and system-level tradeoffs in both receive and transmit paths. Attendees will gain insight into Rx SWaP solutions with a review of available Multiplexer, Switched Filter Banks and Antennas and consideration for SWaP on Tx side with high-density combiners. Further, we will review the tradespace for tailoring RF performance verses size in multiple dimensions.

Key Takeaways for RF and EW Designers

  • Understand the core SWaP challenges in airborne EW systems and their impact on wideband, high-frequency front-end design

  • Gain insight into key design tradeoffs, including size versus performance, insertion loss versus selectivity, and integration complexity

  • Explore representative component approaches, including compact antennas and filter solutions
When
Wednesday, May 13, 2026 · 11:00 a.m. Eastern Time (US & Canada) (GMT -4:00)
Presenters
1776086842-0ed18253aea2b85f
Tom Dekker
Sr Product Marketing Manager, Nuvotronics
During Tom’s 3 year tenure at Nuvotronics, he’s been responsible for the product offerings and roadmap definition to the defense markets including products such as Filters, Integrated Filters, Antennas, Couplers, Baluns and Combiners.

Tom’s prior industry roles have focused on new solutions into radio electronics in both passives (Filtronic, Toko) and active devices for SSPAs applications with extensive time pioneering Gallium-Nitride on Silicon-Carbide (GaN-SiC) HEMT at Cree and driving Silicon (Si) LDMOS into ultra-high power SSPAs during a tenure at Ampleon.
1776086897-addf314893398fb8
Alexander Smith
RF Product Application Engineer, Nuvotronics
Alexander Smith is an RF applications engineer specializing in RF, analog, and mixed-signal hardware development. He has led the design, verification, and production of high-volume, multi-protocol communications platforms for the smart energy and smart city sectors, developed and deployed in-line RF production test suites, and advised on high-reliability PCBA design for manufacturability.
Reserve Your Spot
First Name*
Last Name*
Email Address*
Company Name*
Job Title*
Street Address 1*
Street Address 2
State / Province*
Zip / Postal Code*
City*
Country*
What is your primary SWaP challenge today?*
Reducing size/weight of front-end components
Managing power consumption
Achieving wideband coverage
Integrating multiple functions into a single module
Maintaining performance (e.g., low loss, high selectivity) in compact designs
Other
Which components or solutions are you most interested in evaluating?*
Multiplexers
Switched filter banks
Compact/wideband antennas
High-density combiners (Tx)
Integrated front-end solutions
Other
What is your expected project timeline?*
< 6 months
6–12 months
12+ months
Research / exploratory phase
✓
✓
✓
Microwave Journal's® privacy policy:
Learn More
We use BigMarker as our webinar platform. By clicking Register, you acknowledge that the information you provide will be transferred to BigMarker processing in accordance with their Terms of Service and Privacy Policy.
Powered by BigMarker