Explore the advantages and disadvantages of two prominent options for embedded designers: the IoT Modem Reference Design and IoT SOC Modules. We'll delve into the pros of the IoT Modem Reference Design, which offers flexibility, scalability, and customization, enabling designers to tailor their IoT solutions to specific requirements. Conversely, we'll also discuss the benefits of IoT SOC Modules, such as simplified integration, reduced development time, and cost efficiency, making them an attractive choice for rapid deployment and prototyping projects.

Panel Moderator: Fred Yentz, CEO & Founder, IoT Launch
- Marco Argenton, VP Product Management, IoT Modules, Telit Cinterion
- Dima Feldman, Vice President of Product Management and Marketing, Sony Semiconductor Israel

Introduction to Fibocom's Mobile Computing PCBA Solutions
- Jim Engleson, Director, Strategic Partnerships, Fibocom
Fred Yentz
CEO & Founder, IoT Launch LLC
An experienced technology executive with proven success and strong global business development experience within the Internet of Things and Industrie 4.0 market sectors. Fred has successfully launched world-class Industrial IoT software and cloud-based IoT service platforms targeting customers from small innovator companies up to and including Fortune 500 corporate customers.
Marco Argenton
VP Product Management, IoT Modules, Telit Cinterion
Marco Argenton is the VP Product Management for IoT modules at Telit Cinterion.

In this role, Mr. Argenton’s charter is to define and manage the Product Roadmap across all the cellular technologies, taking care of the product life-cycle and performance analysis, in order to determine the positioning and profitability. He facilitates between different internal departments, identifying new business opportunities and ensuring that the company’s commercialization of the cellular module portfolio is aligned with corporate objectives.

Previously Marco was responsible for Product Marketing in the EMEA region.

A popular speaker for the company, Mr. Argenton has focused his work in the IoT space specifically for over a decade - tracking trends, presenting market analysis, and IoT technology evangelization.

Prior to Telit, Mr. Argenton worked at hardware electronics organizations in EMEA holding product manager, project manager, and electronic engineering positions. He holds a degree in Telecommunications Electronic Engineering from the University of Trieste and has completed post-graduate courses at the CUOA Business School in the areas of Innovation and R&D.
Dima Feldman
Vice President of Product Management and Marketing, Sony Semiconductor Israel
Dima Feldman is the Vice President of Product Management and Marketing at Sony Semiconductor Israel. Dima is responsible for product management, marketing, and system architecture for cellular IoT and edge AI products, in his role he is collaborating with customers and partners on innovative IoT solutions. He brings over 25 years of experience in semiconductors and communication technology to the role. In previous positions, Dima led product management and system architecture, hardware, and RF development teams.

Dima holds an Executive MBA from the Hebrew University and a master’s degree in electrical engineering from the Tel Aviv University.
Jim Engleson
Director, Strategic Partnerships, Fibocom
Jim is a seasoned product executive, with 20+ years experience in the mobile computing, 4G/5G Wireless WAN, and IoT markets. Jim’s multinational carrier has included postings in Japan and Silicon Valley with Palm Computing, before returning home to Vancouver Canada with Sierra Wireless. In 2021, Jim joined the Americas IoT team at Fibocom Wireless, where he is now focused on growing Fibocom’s share in the IoT ecosystem.
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