Webinar: Tackling EMI/EMC Challenges: One Rule at a Time by Horizon House Publications

Tackling EMI/EMC Challenges: One Rule at a Time

About

If you’re not a signal integrity (SI) expert, the thought of EMI/EMC issues might bring you chills. As PCB simulation tools continue to improve, it’s important to incorporate signal integrity checks early in the design process. Instead of waiting for the analysis results after laying out your PCB, why not implement best practices into your verification process?

In this webinar, we will look at common EMI/EMC issues and how they can be traced back to design best practices. Additionally, we’ll look at how to use rule-based verification to automatically check for indicators, saving time and reducing costs.

Attendees will learn:

The effect of PCB miniaturization on signal integrity

Common DRC setups to identify EMC errors early

How to improve quality by incorporating automated verification for EMI/EMC

Who should attend?

Beginner to mid-level PCB designers and signal integrity engineers. The purpose of this webinar is to add a skillset that helps free up the time of the signal integrity expert. This webinar also encourages users to add best practices into their current workflow by adopting this methodology.

Please Note: By registering for this webinar, the details of your profile may be used by Signal Integrity Journal™, the presenter, and the sponsor to contact you by email.

Presenter

Harry Kennedy

Technical Specialist, Electronic System Design, Altair

Harry A. Kennedy is an Engineer who’s excited about all things that deal with printed circuit boards. He is a Technical Specialist in Electronic System Design for Altair, where he helps customers solve problems ranging from simulation, verification, and PCB manufacturing technologies. Before that, he started working in the semiconductor industry at Texas Instruments 7 years ago as a validation and then applications engineer supporting automotive high side drivers. Harry has a bachelor’s degree in Electrical Engineering from Ohio State University.

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