About

Sponsored by: Keysight Technologies, Samtec, Qorvo and NXP Semiconductor


Panel Participants: Eric Bogatin (University of Colorado Boulder - moderator), Heidi Barnes (Keysight Technologies), Istvan Novak (Samtec), Masashi Nogawa (Qorvo), and Daniel Beeker (NXP Semiconductor)



Abstract:

Every product uses some form of power distribution network (PDN) to power all the active devices in the system. PDN design is hard because every product is custom. There are more than nine orders of magnitude differences in the current and impedance requirements of a PDN across product applications. It is impossible for one design or even one set of design guidelines to apply to all systems. This panel brings together industry experts to provide their perspectives on the challenges and solutions in designing and implementing a PDN for next-generation products. Prof Eric Bogatin moderates this panel.



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Presenters
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Eric Bogatin
Prof, CU, Boulder and Technical Editor of the SIJ
Eric Bogatin is currently a Professor in the ECEE dept at University of Colorado, Boulder, where he teaches courses on PCB design, signal integrity and systems engineering. He is also the technical editor of the Signal Integrity Journal and a Fellow at Teledyne LeCroy. Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. He has written 15 technical books in the field and presented classes and lectures on signal integrity worldwide.
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Heidi Barnes
Senior Power Integrity Application Engineer, Keysight Technologies
Heidi Barnes is a Senior Application Engineer for High-Speed Digital applications in the Design Engineering Software Group of Keysight Technologies. Her recent activities include the application of electromagnetic, transient, and channel simulators to solve signal and power integrity challenges. Author of over 40 papers on SI and PI, active member in developing the new IEEE-370 Standard involving interconnect S-parameter quality after fixture removal, and recipient of the DesignCon 2017 Engineer of the Year. Prior experience includes seven years in signal integrity for ATE test fixtures for Verigy, eight years in RF/Microwave microcircuit packaging for Agilent Technologies, and 10 years with NASA in the aerospace industry. She has been with Keysight EDA software since 2012. She holds five patents, and was awarded the NASA Silver Snoopy for her work on hydrogen fire and gas detection. Heidi graduated from the California Institute of Technology in 1986 with a bachelor’s degree in electrical engineering.
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Istvan Novak
Principal Signal and Power Integrity Engineer, Samtec
Istvan Novak is a Principal Signal and Power Integrity Engineer at Samtec, working on advanced signal and power integrity designs. Prior to 2018 he was a Distinguished Engineer at SUN Microsystems, later Oracle. He worked on new technology development, advanced power distribution, and signal integrity design and validation methodologies for SUN's successful workgroup server families. He introduced the industry's first 25 μm power-ground laminates for large rigid computer boards and worked with component vendors to create a series of low inductance and controlled-ESR bypass capacitors. He also served as SUN's representative on the Copper Cable and Connector Workgroup of InfiniBand, and was engaged in the methodologies, designs and characterization of power-distribution networks from silicon to DC-DC converters. He is a Life Fellow of the IEEE with twenty-nine patents to his name, author of two books on power integrity, teaches signal and power integrity courses, and maintains a popular SI/PI website. Istvan was named Engineer of the Year at DesignCon 2020.
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Masashi Nogawa
Principal Systems Engineer / Senior Member of Technical Staff, Qorvo
Masashi Nogawa is a Principal Systems Engineer and Senior Member of Technical Staff in the power-management division at Qorvo. With over 25 years of experience in power electronics, he is responsible for defining new power regulation and conversion products. Masashi holds a BS and MS in Electrical Engineering from the University of Electro-Communications in Tokyo, Japan, and has fourteen U.S. patents in areas ranging from switching regulators to display controllers.

He is actively engaged in writing and publishing articles, as well as developing simulation software. Masashi authors the ongoing series "RF Signal Integrity to Power Integrity" for Microwave Journal and, GitHub, shares Python-wrapper software PyQSPICE for the QSPICE simulator.
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Daniel Beeker
Technical Director, NXP Semiconductor
With more than 44 years of experience in electronic system design and EMC, Daniel Beeker provides application support for NXP Automotive customers worldwide. Daniel also supports NXP customers globally with special function development tools and instrumentation. Daniel specializes in EMC and signal integrity design techniques for systems and PCBs, especially in low-layer count designs. In support of this, Daniel has completed more than 250 PCB design evaluations for customers and internal NXP products. Daniel teaches field-based design techniques at NXP and industry conferences worldwide, with more than 150 sessions with more than 6000 attendees since 2010. Daniel is also involved with NXP IC package design and IC development tool teams to support improved EMC performance, working on more than 25 IC designs.
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