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Integrated RF SoCs are revolutionizing system architectures. Traditional RF interconnects strain form factor, weight and financial budgets as RF channel counts increase. In this webinar, Samtec technical experts will detail novel solutions for routing high-frequency RF signals via array connectors. Additionally, recommended launch optimizations and PCB stack-ups will be presented.
Matthew Burns
Technical Marketing Manager, Samtec
Matthew Burns develops go-to-market strategies for Samtec’s Silicon-to-Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.
Kiana Montes
SI Application Engineer, Samtec
Kiana Montes received her B.Sc in Electrical Engineering focused on signal integrity from the Pennsylvania State University Harrisburg. She is a signal integrity application engineer with experience in simulation and optimization of high-speed digital and RF interconnect PCB breakouts.
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