Webinar: 2000 Amp PCB Power Delivery Design, Simulation, and Measurement Challenges by Horizon House Publications

Signal Integrity Journal

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2000 Amp PCB Power Delivery Design, Simulation, and Measurement Challenges

About

Massive processors for big data, AI, and 100+ Gigabit communications are already reaching 2000 Amps on their core power rails. The next generation of AI/ML ASICs will reach 5000 Amps in just a few more years. This presentation will discuss critical aspects of designing, simulating, and measuring high-current power rails and assessing available topologies to balance performance and cost trade-offs. You will learn how to:

Simulate with multi-phase parallel VRM models to predict PDN impedance and large and small signal responses in the time domain.

Include PCB EM models for DC IR drop, thermal, and AC decoupling to analyze the smallest PCB artifacts and the impact on the desired micro-ohms target impedance.

Measure and validate the 2000 Amp power rail using a unique ultra-high-speed transient step loader with ns response times to reach 100% duty cycle for testing thermal and electrical design limits.

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Presenters

Heidi Barnes

Senior Application Engineer and Power Integrity Product Owner, Keysight

Heidi Barnes is a Senior Application Engineer and Power Integrity Product Owner at Keysight, specializing in High-Speed Digital applications. With 26+ years of experience in the field of electronic design automation, her recent activities include the application of electromagnetic, transient, and channel simulators to solve signal and power integrity challenges. She contributed to the IEEE-370 Standard on fixture removal for high-frequency interconnects and is Co-Chair for the IEEE EPS EDMS Packaging Benchmark Sub-Committee. Heidi holds five patents and was awarded the DesignCon Engineer of the Year in 2017.

Benjamin Dannan

Chief Technologist, Signal Edge Solutions

Benjamin Dannan is the Chief Technologist at Signal Edge Solutions, a senior member of IEEE, and an experienced signal and power integrity (SI/PI) design consultant, advancing high-performance ASICs and developing advanced packaging solutions for high-speed digital designs. He is a Keysight Certified Expert in ADS and holds a certification in cybersecurity. He has a BSEE from Purdue University, a Master of Engineering in Electrical Engineering from The Pennsylvania State University, and graduated from the USAF Undergraduate Combat Systems Officer training school with an aeronautical rating. Benjamin is a trained Electronic Warfare Officer in the USAF with deployments on the EC-130J Commando Solo in Afghanistan and Iraq, totaling 47 combat missions, and a trained USAF Cyber Operations Officer. In addition, he has co-authored multiple peer-reviewed journal publications on SI/PI-related topics and has twice received the prestigious DesignCon Best Paper award.

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