Smart devices today demand secure wireless connectivity, longer battery life, and a simpler path to deployment. This is true for applications from connected defibrillators to badge printers and commercial door locks. The challenge? Two-chip designs are bulky, and single-chip SoCs often fall short on RF performance.
In this webinar, Ezurio and Infineon will demonstrate how you can replace two-chip systems with a secure, low-power module built for next-gen devices. The Veda IF912/913 modules feature Infineon’s AIROC™ CYW55912 and CYW55913 chipsets. They have built-in Wi-Fi 6/6E + Bluetooth® LE and flexible SoC/NCP modes. This single platform can be used across multiple industries.
What you will learn: •Real-world examples where bulky two-chip designs were replaced by a streamlined, scalable single-chip solution.
•How Infineon’s AIROC™ CYW5591x family integrates compute and connectivity to solve key design challenges around power, size, and RF performance.
•When to choose NCP vs. SoC modes and how this flexibility supports a range of device classes and architectures.
•How Ezurio’s globally certified Veda IF912/913 modules accelerate time to market with expert technical support and regional approvals.
•Why IF912/913 is part of Ezurio’s premium module portfolio—and how to access early samples for evaluation.
Senior Product Manager - Wi-Fi and Bluetooth at Ezurio
Andrew Ross, Senior Product Manager at Ezurio responsible for IoT Device and Module products offering Wi-Fi & Cellular solutions. Andy is based in California and has more than 25 years of experience in wireless technology, having spent time at...
As Senior Director of Product Management, Andrew Hart oversees Infineon’s AIROC™ Wi-Fi and Bluetooth™ Combo solutions for IoT including Home Automation, Handheld Devices and Wearables. Applying over 25 years of experience in networking, embedded...