The continuously increasing thermo-mechanic reliability requirements for e.g. automotive electronics and 5G hand-held PCBs need a better understanding of all production processes.
Apart from the contribution of the well-known factors like base material properties, pressing/lamination and drilling conditions, de-smearing and deposition parameter of the conductive seed layer, the set-up of the electrolytic copper process plays an important role in advanced interface reliability between stacked micro-vias.
The webinar introduces you to the subject and will provide an overview of the latest findings and developments in electrolytic copper.
Stacked-via interface reliability: test procedure by reflow simulation
Overview of influencing production factors
Electroplated copper – important parameter for best nucleation on conductive interfaces
Senior Specialist Electroplating
Educated in Materials Science – working since 1987 in the development and field in different positions on wet-chemical metallization technologies for electronic application.
Worked several years as Project Manager in Taiwan for ICS and HDI production sites.