Improving adhesion between copper and lamination resin is one of the biggest challenges in micro-electronic manufacturing, such as IC substrates. Bonding enhancement process by surface roughening is the most commonly used method, due to providing the highest possible mechanical interlocking. In this process typically 1-2 µm of copper needs to be removed for reliable adhesion of resin to the copper surface. Follow rapid development of electronics industry, where fine L/S (< 10 µm) and good signal propagation at higher frequency are required, the conventional approach to ensure good adhesion of the conductor to the dielectric of roughening the dielectric to achieve mechanical adhesion is no longer applicable.
A pre-requisite for the next generation, high frequency IC substrate, is a new way to enhance adhesion of the dielectric material to conductor. This must be independent of surface morphology or roughness. In this webinar several adhesion promotion methods for IC substrate manufacturing will be introduced – low or no copper removal process, ensuring reduced signal losses whilst meeting industry standards.
Background – the limitations for high roughening systems for next generation IC substrate manufacturing
Atotech-STT product solution portfolio for IC substrate manufacturing
Low or no copper removal adhesion promotion system
Global Product Manager Surface Treatment Technology
Joined Atotech Group in 2014, initially in the role of R&D Scientist. In 2019 Thomas was appointed as Global Product Manager for Surface Treatment Technology product team.