Electroless nickel/electroless palladium/immersion gold ENEPIG is a highly reliable finish with a broad application field due to its multiple soldering and bonding capabilities. In this webinar, we will introduce PD-Core® as a new electroless plating electrolyte to deposit pure palladium layers. It allows operating the process with lower palladium content and higher process robustness. PD-Core® can be combined with the latest gold electrolyte Aurotech® G-Bond 2 and with this can offer the best performance ENEPAG finish with high process robustness and excellent bath stability. Performance data of various tests will be presented to show the benefits of this process compared to conventional electrolytes.
Outlook to new ENEPAG
Dr. Britta Schafsteller
Global Product Manager Selective Finishing
Educated in Chemistry and joined Atotech in 2004 as R&D chemist in the field of final finishing. After 11 years as R&D manager for selective finishing moved to the position of the Global Product Manager in April 2019.