Full name*
Email Address*
Job Title
Marketing Permission
Atotech Group will use the information you provide on this form to be in touch with you and to provide updates and marketing. We will not share or sell your personal information. You can unsubscribe anytime by clicking the unsubscribe link in the footer of our emails, or by replying to our emails and asking to be unsubscribed. For more information, please read our privacy policy.
Yes, I consent to receiving emails other than the invitation*
We use BigMarker as our webinar platform. By clicking Register, you acknowledge that the information you provide will be transferred to BigMarker processing in accordance with their Terms of Service and Privacy Policy.
The Semi Additive Process (SAP) enables very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and spaces (L/S) of 10/10 µm and less the copper thickness variation is one of the critical parameters, which must be controlled within a tight range to avoid reliability problems in assembly or during the lifetime.

The challenges and requirements for a new copper electrolyte to fill the gap between the organic IC-substrate and the semiconductor technology have increased over time with the shrinkage of the L/S and the smaller pattern features on the substrate.

During this webinar, we will highlight the requirements for next generation IC Substrate plating processes and the results of our newly developed process InPro® SAP3 such as plated copper thickness and copper thickness variation, BMV filling performance, microsection pictures and reliability results.
  • Introduction
  • Evolution of PCB manufacturing & Cu electrolyte development
  • Development targets for next generation ICS process
  • Our solution: InPro® SAP3
  • Outlook
  • Q&A sessiom
Global Product Manager Panel and Pattern Plating

Henning studied Industrial Engineering at Technische Universität in Berlin, majoring in Chemical Engineering. Starting in 2007 with MKS’ Atotech, he gained broad knowledge and experience regarding electroplating processes within company`s internationally focussed environment. As an expert in the panel and pattern plating field, he was promoted to Global Product Manager in 2013.