Leadframe-based microelectronics packages are widely used in the semiconductor industry. Increased reliability requirements, especially for automotive applications, have led to extensive adoptions of adhesion promoter technologies on leadframes, with the purpose of enhancing the adhesion between leadframe metal surfaces and chip encapsulation materials, such as epoxy molding compounds (EMC). This is essential to ensure good chip level reliability (CLR) of the microelectronics packages.

In general, the current available adhesion promoter techniques used for leadframes include copper roughening process (etching process) and rough copper plating for selective Ag plated/Cu leadframes, as well as rough Ni/Pd/Au finishing for pre-plated frames (PPF). Though it is clear that making the leadframe surface rougher could enhance the adhesion of leadframe to EMC, that eventually leads to improved CLR, the rough leadframe surface on the other hand can cause many assembly issues, such as die glue bleed out problems and difficulty in deflashing process after molding.

During this webinar, we will introduce ppFrep – our a non-etched, non-roughened innovative adhesion promoter for PPF which does not involve the conventional ways of creating rough leadframe surface for better adhesion with EMC through mechanical bonding. We will also demonstrate all the advantages of this process, explain relevant test results and their implications.
  • Introduction.
  • Adhesion test data.
  • Package reliability results.
  • Operational considerations.
  • Summary
  • Q&A session.
Business Manager Leadframe and Connector

Joined Atotech Group in 1997 as a process engineer and was leading several application teams in the electronics sector over the time. Since 2012 he oversees the global application work regarding ECD plating activities in the semiconductor area.