New High-tech and cost-effective solutions for package substrates
About This Webinar
The global IC packaging industry is evolving fast and therefore the need to accommodate new end-market requirements for package substrates used in 5G/6G, Internet of Things, Artificial Intelligence and many others. This development brings along new challenges to the industry, including increased input/output counts, reduced lines and spaces, improved signal integrity and continuous cost pressure.
During this webinar, we will discuss the latest market developments and introduce our newest suite of innovative solutions targeting final finishing for packaging substrates. Sandra will explain why our solutions not only meet the newest industry requirements for performance and cost but prove to you that in some areas we can exceed them. For soldering applications, this webinar will introduce you to an immersion tin plating process specifically designed for IC substrates: Stannatech® IC.
For both, soldering and bonding applications we will shed light on the latest product developments for ENEPIG and EPAG. For the ENEPIG and EPAG processes, we will introduce PD-Core® and G-Bond® 2 as new electroless plating electrolytes to deposit pure palladium and semi-autocatalytic gold layers. PD-Core® is tailored as drop-in solution for existing ENEPIG lines as well as direct plating on copper – so different applications could be processed in one line. Performance data of various tests will prove the technical ability of all presented finishes.
Immersion tin: Stannatech® IC
ENEPIG: Universal ASF®
EPAG: PallaBond® / PD-Core®
Global Assistant Product Manager Selective Finishing
Sandra has been in the PCB and IC packaging industry since 2015 when she began working for Atotech. After being an application engineer for two years she was promoted to Global Assistant Product Manager position for all Final Finishing processes. She holds a M.Sc. degree in Industrial Engineering in the field of chemistry and chemical engineering (TU Berlin).