Latest developments for void-free filling of laser and mechanically drilled through vias

A variety of technologies, including thermo-conductive paste plugging and electrolytic copper plating, are used to fill through vias in package substrates and printed circuit boards. Electrolytic copper plating, especially with pure metallic copper, offers significant advantages over thermo-conductive paste plugging, particularly in terms of much higher thermal conductivity. This makes it preferable for high-end applications such as laser-drilled through vias. As electrolytic plating processes continue to advance, they are gradually replacing paste plugging, demonstrating improved capabilities for larger size and higher aspect ratio vias.

In this webinar we will demonstrate the benefits of copper through via filling, explain how through via filling technology has evolved over the years, why inclusion-free through via filling is critical and how it can be achieved in panel and pattern plating mode. In addition, Henning will demonstrate the current state of the art in through via dimensions and corresponding aspect ratios for advanced applications.