Innerlayer bonding process of choice for ultra-fine line package substrates
About This Webinar
Driven by an increase in design complexity and growing demand for high input and output in package substrates, the dimension of conductor tracks line and spaces is predicted to be reduced gradually to 5/5 µm and lower. The conventional approach to ensure good adhesion by only relying on mechanical anchoring is no longer suitable. Excessive etching of conductor tracks from the roughening process has a detrimental effect on the line integrity, hence creating inevitable functional failure.
During this webinar, we will be introducing a newly developed bonding enhancement system that focused on the synergy of fine nanostructure and organic adhesion promoter called hybrid bonding. A smooth interface and fine line processing capability is one of the most appealing strengths of a hybrid bonding system over the conventional bonding system. By properly choosing the chemical adhesion promoter, the process could provide highly reliable adhesion of copper-polymer and excellent thermal reliability without detrimental effects on the full build-ups. A simple process and high material compatibility of a hybrid bonding system define a quick decision of using the process for ultra-fine line package substrates.
Challenges in ultra-fine line and space IC packaging
Adhesion enhancement technology
Dr. Thomas Thomas
Global Product Manager Surface Treatment
Joined MKS’ Atotech in 2014, initially in the role of R&D Scientist. In 2019 Dr. Thomas was appointed as Global Product Manager for Surface Treatment Technology product team.