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Next generation packaging applications require ever smaller structures without compromising on the reliability of the devices. To achieve this, highly pure and sophisticated plating chemicals are required, which allow the deposition of fine RDL structures combined with the ability to fill vias and thus allow the buildup of several layers of RDLs.

In the webinar we will talk about the requirements and challenges of the semiconductor industry regarding electrolytic plating of Cu RDLs for next generation advanced packaging applications and how the best results can be achieved. Additionally, we will discuss how highly pure copper leads to increased reliabilities for the semiconductor devices of the future.
  • Introduction to MKS | Atotech
  • Future needs for ECD Cu plating in advanced packaging
  • Spherolyte Cu UF3 – Highly pure fine line deposition and via filling
  • Q&A session
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Global Product Manager Semiconductor

Has researched surface functionalization of semiconductor materials during his PhD and afterward spent some years in strategic management consulting. In 2021 he joined Atotech Group as Global Product Manager Semiconductor.
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Senior Global Application Manager Semiconductor

Joined Atotech Group in 1997 as a process engineer and was leading several application teams in the electronics sector over the time. Since 2012 he oversees the global application work regarding ECD plating activities in the semiconductor area.
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