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About This Webinar
In today’s world with its increasing demand for power semiconductor devices for electrification, e-mobility, and enabling the flexible use of green energy it has become more and more imminent that it is not only necessary to involve new semiconductor materials (e.g. SiC, GaN) but also apply alternative manufacturing technologies to maintain the flexibility and reliability on the next generation of power semiconductor devices.

During this webinar, we will introduce our electroless metallization solutions that are part of these alternative technologies for power semiconductor device manufacturing. Most of the processes have been established in the industry over the past 10 years with their benefit of providing maskless metallization with higher throughput capability at a reduced cost of ownership compared to physical metallization techniques. We will present these advantages as well as the latest market developments and demonstrate our newest suite of innovative solutions targeting final finishing for Power semiconductor devices.
Agenda
  • Introduction
  • Pretreatment for Al and Cu based semiconductor devices
  • 3. ENEPIG: Xenolyte Ni, Xenolyte Pd, Xenolyte Au
  • Q&A session
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Dr. Tobias Helbich
Global Product Manager Semiconductor

Has researched surface functionalization of semiconductor materials during his PhD and afterward spent some years in strategic management consulting. In 2021 he joined Atotech Group as Global Product Manager Semiconductor.
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Dr. Stefan Pieper
Global Application Manager Electroless Processes – Semiconductor

Stefan has studied chemistry in Berlin, Germany where he also completed his PH.D. in analytical chemistry. In 2009 he joined Atotech as Application Scientist for electrochemical deposition processes for Semiconductor applications. In 2020 he became Global Application Manager for Electroless deposition processes for Semiconductor applications.
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