Advanced automated systems for fine-line and space requirements in HDI and package substrates
About This Webinar
PCB manufacturing of HDIs and IC substrates with fine lines and spaces requires a high focus on uniform copper deposition, thin copper thickness and minimized defects to maximize the production yield. In addition to this the consumption of resources such as water, energy and chemistry need to be minimized without compromises on process performance.
To meet these requirements, we focus on reliable transportation systems, uniform fluid performance, precise control of key process and production parameters, foreign material control and quality control. Moreover Atotech equipment is well known for its high level of automation bringing benefits for high quality, reduces failure risks, enables a safe operation with chemical fluids and minimize the environmental impact.
Market & technology trends
Key challenges and equipment solutions
Horizontal equipment solutions
Vertical equipment solutions
Global Product Manager Horizontal Electronics Equipment
Joined Atotech in 2010 as Project Planner for technical planning of horizontal PCB-equipment department (Uniplate, Horizon, special projects). Promoted to his current position at 2017 with the emphasis on for horizontal PCB-equipment (Uniplate, Horizon and Polygon). Based in Nuremberg, Germany
Global Product Manager Vertical Electronics Equipment
As material scientist, Dirk Ruess started his career in the ceramic industry as development engineer. After gathering several years experiences as Application Engineer and Sales Manager in the ceramic, sputtering and optical industry, he joined Atotech in 2007 as Sales Manager for horizontal equipment. As Business Development Manager, he was responsible for new products and was promoted 2018 to Global Product Manager for Vertical Systems.