The demand for flexible and rigid/flex PCBs has been continuously growing in recent years, mainly driven by new developments in smartphones, wireless earphones, wearables, medical and automotive electronics. This growing demand also brings new technical challenges and requires specific solutions for the plating processes, in particular the final finishes.

In this webinar, we will also introduce our new final-finish solutions for plating immersion tin and electroless nickel, which both are specifically designed to comply with the new challenges and deliver outstanding properties and performance.
  • Introduction and background.
  • Stanna-Flex – immersion tin for flex substrates.
  • Aurotech Flex – ENIG/ENEPIG for flex substrates.
  • Q&A session
Global Product Manager Selective Finishing

Educated in Chemistry and joined Atotech in 2004 as R&D chemist in the field of final finishing. After 11 years as R&D manager for selective finishing moved to the position of the Global Product Manager in April 2019.