About This Webinar
The use of a bonding enhancement process, such as Atotech’s market leading BondFilm system, is required for multi-layer board fabrication. While the high surface roughness typical for such a process is advantageous for the best possible bonding performance, this is also a distinct disadvantage for high frequency, or 5G applications where the smoothest possible copper surface is beneficial.

To meet the target of low signal loss for high frequency applications the printed circuit board (PCB) manufacturer has a choice of two opposing paths. Evolution – where the standard Oxide replacement system can be modified or changed, though with some limitations; Revolution - where a totally new system is adopted, most likely at some considerable expense, but with the best possible SI performance.

Which is the right manufacture direction to take?

Evolution or Revolution?
Agenda
  • Background – the limitations for high roughening systems for high frequency production.
  • Evolution – modification of Oxide replacement solutions to create a drop in alternative.
  • Revolution – the adoption of a new direction for bonding enhancement, where new process equipment is required.
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Neal Wood
Global Product Marketing Manager Surface Treatment Technology
Having joined the company in 1992, initially in the role of Development Chemist, Neal has progressed through a number of Customer Support functions until he was appointed in his current position in spring 2018.

Based in Worcestershire, England, Neal enjoys cycling, angling and soccer.

E-mail: neal.wood@atotech.com