About
Ethernet connectivity for Space applications is rapidly becoming the backbone of next-gen spacecrafts, as modern architectures evolve toward higher data throughput, modularity, and software‑defined functionality. Modern missions—especially LEO constellations and advanced Earth‑observation platforms—require scalable, interoperable networks that can handle complex payloads and distributed processing.

In this webinar, we’ll review Microchip’s scalable approach for supporting connectivity requirements across all kind of missions, from LEO to Deep Space applications. We’ll learn on diverse Microchip proposals (Ethernet, CAN, Spacewire…) for delivering the bandwidth, simplicity and interoperability that next‑generation spacecraft design requires, aligned with the industry’s push for flexibility, autonomy, and standardization.
When
Tuesday, 23/06/2026 · 11:00 a.m. Madrid (GMT +2:00)
Agenda
  • Microchip Technology Company Overview
  • Scalabie approach: from LEO to Deep Space applications through several quality grades
  • Ethernet connectivity for Space applications
  • Other Microchip communication interfaces (CAN, Spacewire…)
  • Q&A
Presenters
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Eric TINLOT
Aerospace and Defense Marketing Engineer
With a bachelor’s degree in Electronic Engineering, I have worked in the semiconductor industry for almost 30 years, mainly in the microcontroller segment. My career has progressed from technical roles, including Application Lab Engineer, to technical marketing positions covering industrial and automotive markets. Over the last decade, I have focused on the space and defense sectors.
J
José Soto
Aerospace & Defense Principal CEM
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